Researchers at the University of Virginia (UVA) have achieved a breakthrough in understanding heat flow in thin metal films, paving the way for more efficient and sustainable computer chips.
Supported by the Semiconductor Research Corporation and Intel, the study confirms that Matthiessen’s rule—a principle governing thermal conductivity—remains valid even at nanoscale dimensions. This discovery is critical for designing next-generation chips that are faster, smaller, and consume less energy.
Lead researcher, Md. Rafiqul Islam, highlighted the importance of managing heat in modern devices like gaming consoles and AI-powered data centers, where high-power processing creates thermal bottlenecks. The findings provide a framework for refining heat flow in ultra-thin metals, such as copper, which are widely used in chip interconnects.
By validating Matthiessen’s rule, chip designers now have a reliable tool that can predict and optimize heat behavior, enabling the creation of cooler and more energy-efficient technology. This research holds particular promise for very-large-scale integration (VLSI) technology, where effective thermal management is crucial for performance.
UVA, Intel, and the Semiconductor Research Corporation conducted a study which combined experimental work with advanced modelling, enhancing the thermal efficiency of CMOS (complementary metal-oxide-semiconductor) technology—a key component in devices from smartphones to medical equipment. These advancements mark a significant step toward a future of high-performance, sustainable electronics.
